3-D chip stacks - Future of Computing?
March 23, 2008
Mr. Moore predicted that the number of transistors that fit on a piece of silicon would double almost every two years. However, this axiom will be trumped in 15 years or less. This is due to the increasing difficulty faced when manipulating transistors the size of atoms. So, what direction can our favourtie piece of silicon go?
It looks like IBM has been working on a solution to help. It’s called a 3-D chip stack and it looks promising. Hypothetically, it’s possible to move data 1000X faster than we do now. How? Using TSVs (through-silicon vias) that go through the chip and connect to the next layer directly below it. Currently, chips connect along the outer edges which is slow and limiting.
Keep your eyes peeled — IBM is slated to begin selling this technology soon.
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