IBM Thinkpad X200 - Specs
June 8, 2008
IBM Thinkpads are fantastic laptops (when they’re not failing) and they have just gotten better. IBM has released preliminary specifications for their all-new X200 laptop. These beautiful details are guaranteed to get your heart pumping.
The Specs:
- 12-inch WXGA panel
- 45nm Core 2 Duo CPUs up to 2.4GHz
- Intel Centrino 2 with vPro technology
- SSDs up to 64GB
- WiMAX / WWAN / GPS / WiFi / UWB /
- Bluetooth
- Magnesium alloy top and bottom covers
- 9.6-hours of battery life on the 9-cell pack
- DDR3 RAM
- 1.3-megapixel camera
- DisplayPort connector
- 3 USB ports
- Starts at 2.93 pounds
RAmos V8 - a PMP that’s 1.3″ away from being enjoyable
June 7, 2008
We were once excited to see that a gigantic screened PMP would be joining the good fight. Wouldn’t you be excited when you read that the possible specs included a 4.3-inch touch screen, WiFi, 16GB of memory and great styling!
However, it turns out that the V8 is including typical specs:
- 3-inch screen
- 4GB storage
- Rockchip processor
- PlayFX
The good news is the price, a measly $86. Thanks…I’ll take 10
MSI Titan - So tiny it’s kinda cool
May 9, 2008
MSI’s Titan has been released and it’s looking great! MSI aimed to release the Titan before the Eee PC and it succeeded. Measuring in at a microscopic 9.45″ x 7.28″ x 2.75″ it’s much like a cappuccino pc — in dimensions that is.
Featuring:
- 2 GHz Via C7 CPU
- 250GB SATA HDD
- 1GB DDR2 RAM
- 2x USB 2.0 ports
- 5.1 digital audio out
- Gigabit Ethernet
- Dual-Layer DVD writer
- VGA and TV out
This little guy sure seems to pack some punch and we’re excited to receive ours in the mail for some testing!
Spyshots - Asus’s Eee PC Desktop
March 29, 2008
HotHardware released these not so official images of the upcoming Asus Eee PC Desktop. Although the picture shows that they have definitely got their styling right, we’re going to wait to see what’s inside before dropping a couple of hundred on this beauty.
“We should caution you that these are not “official” pictures per se. In fact, we can’t really comment on the source of these pics except to say that they are indeed shots of an Asus Eee PC Desktop product that should be arriving to market some time in the next quarter or so.” –HotHardware.com
3-D chip stacks - Future of Computing?
March 23, 2008
Mr. Moore predicted that the number of transistors that fit on a piece of silicon would double almost every two years. However, this axiom will be trumped in 15 years or less. This is due to the increasing difficulty faced when manipulating transistors the size of atoms. So, what direction can our favourtie piece of silicon go?
It looks like IBM has been working on a solution to help. It’s called a 3-D chip stack and it looks promising. Hypothetically, it’s possible to move data 1000X faster than we do now. How? Using TSVs (through-silicon vias) that go through the chip and connect to the next layer directly below it. Currently, chips connect along the outer edges which is slow and limiting.
Keep your eyes peeled — IBM is slated to begin selling this technology soon.
aizen Design